March 30 – April 1, 2018
Entrepreneurship and Innovation in Emerging Markets
We invite contributions from researchers, educators, managers and students. Contributions may be conceptual, theoretical, or empirical. They should document research activity, case studies or best practices, shedding light on the theory or practice of engineering, technology, or innovation management, entrepreneurship, and address the strategic objective of technological change.
Major topic areas include:
- Entrepreneurship and its ecosystem
- Business Model Innovation in Emerging Markets
- Cross-Border and Local Venture Capital Investment
- New Markets for Entrepreneurs
- Management of Innovation
- Technology Management
- New Technology Directions and Challenges
- Managing Globalization Challenges
- People and Organizations
- Health, Sustainability, and Social Issues
There will be an opportunity to publish in a Special Issue of our journal IEEE Transactions on Engineering Management for selected papers submitted to the conference.
For further details, please refer to http://isie.ieee-tems.org/
The conference will host an Industry Forum inviting speakers from industry leaders around the world that will provide visions and industry in a rapidly developing technology world.
In addition to these core technology management topics, we will open the door to special sessions on management during these challenging times as seen by sponsoring societies, for example, particular management issues as seen within computer, communications, and electronics areas. This is one of the TEMSCON series of conferences offered by IEEE TEMS.
Paper Submission Due: 15 January 2018
Notification of Acceptance: 15 February 2018
Author Registration Due: 1 March 2018
Normal Registration/Hotel Block Deadline: 1 March 2018
Late Registration Begins: 15 March 2018
General Co-chairs: Jin Chen (China, Tsinghua University), Michael Condry (USA, IEEE TEMS President-Elect) Program Co-chairs: Xielin Liu (China, Academy of Sciences University), Xiaohong “Iris” Quan (USA, San Jose State University) Treasurers: Dilip Kotak (Canada), Jing Wang (China, Tsinghua University) Webmasters: Ravikiran Annaswamy (IEEE TEMS), Andanagouda Patil (IEEE TEMS) Publication Chair: Rabiz N. Foda (IEEE TEMS)