Conferences News

TEMS Conferences Update

An Update for the First Quarter of 2017

As a quick overview for what is coming ahead on conferences in the year 2017 the following table should serve you well:

  1. TEMSCON 2017, Santa Clara,US,  June 8-10
  2. ISIE 2017, Edinburgh, UK, June 19-21
  3. ICE/ITMC 2017, Madeira, Portugal, June 26, 27-29, 30
  4. ICMSE 2017, 24th edition in Nomi, Japan, August 17-20
  5. ICDIM 2017, Fukokoa, Japan Sep 12-147.
  6. E-TEMS 2017, Munchen, Okt 19-20
  7. Ethics 2017, Detroit, Nov 12-14

For exact dates or any changes thereto, including but not limited to paper submission deadlines always checkout the respective conference websites.

Update More Details

Time flies and the first quarter has almost passed by. We had to cancel SIIE 2017, one our co-sponsored conferences rescheduled and planned for in April, as only a little over 50 papers had been received. Hopefully all interested prospective attendees will have found an alternative home.

Work is progressing well on our very own and inaugural edition of TEMSCON 2017. The papers have been reviewed and the final program is reaching its final form, including additional workshops, all under the great leadership of Michael Condry and Iris Quan and their teams. Looking forward to a great and interesting series of sessions, workshops and exchange of ideas, thoughts, concepts, experiences and more in June in Santa Clara. Do visit www.temscon.org .

In June there is also the ISIE 2017, http://isie2017.org/ , in Edinburgh on which your Society support  a track on the subject of Entrepreneurship and Management – Challenges for Industrial Electronics.

Likewise the 23rd edition of ICE/IEEE ITMC 2017 is progressing and the schedule has now evolved into a program covering five days in June with three full days core conference on 27th  to 29th of June. The submission of papers is due on March 21st . So if you want your paper to be in, do check out the website www.ice-conference.org for any possible extentions. Aligned with the conference will be the NITIM PhD Summer School, the first deadline is March 17th to submit an extended abstract. Details can be found here: http://www.nitim.org/News-Events/Events/NITIM-International-Graduate-School-2017

This year two co-sponsored conferences will be held in Japan in the months of August and September respectively. In August the 24th edition of ICMSE is expected in Nomi (http://icmse.intl.hit.edu.cn/icmseen/ch/index.aspx ) and in September the 12th edition of ICDIM is planned in Fukuoka (www.icdim.org) .  Paper submission deadline for the first, ICMSE is May 31st 2017 and for the second ICDIM it is July 1st 2017.

As a fall edition of TEMSCON we will have the European Technology & Engineering Management Summit, E-TEMS 2017, in Munich. Continuing the theme of Technology and Management related to Industry 4.0, Digital Transformation and 3D Additive Manufacturing The date has changed: Thursday 19th  and Friday 20th of October. And the venue is currently under negotiation but will not be at BMW as originally intended, old messages will be removed as much as possible. We are currently working amongst others with the local German team of Dr. Thomas Holzmann, Prof. Klaus Sailer, Tina Hofungshoff and your IEEE TEMS AdCom members Brendan Galbraith and Liang Downey to get the program together and the CfP out the door and to update the website of www.e-tems.org .

And similar to the previous editions your TEMS will also collaborate and co-sponsor the IEEE ETHICS 2017 international symposium planned for in the month of November in Ypsilanti next to Detroit. Details are being worked on by your board members. And hopefully soon the website will be up for the 2017 edition.

Next Year

Work is also underway for 2018 with:

  • A TEMSCON Spring Edition 2018 in South Africa, currently planned for in April in Pretoria.
  • And our own IEEE TEMS flagship TEMSCON 2018 in June in Chicago
  • The 24th edition of ICE/IEEE ITMC in June in Stuttgart, Germany
  • A TEMSCON Fall Edition 2018 / E-TEMS 2018 in the Hague, The Netherlands

 

 

About the author

Robert Bierwolf

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