IEEE TEMS ISIE Inaugural Conference Successfully Held in Beijing

The inaugural IEEE Technology and Engineering Management Society’s International Symposium on Innovation and Entrepreneurship (ISIE) was successfully held at Tsinghua University, Beijing, March 30-April 1, 2018. The conference was co-sponsored by the School of Economics and Management, Tsinghua University (China), and the University of Chinese Academy of Sciences, China. The main conference theme is “Entrepreneurship and Innovation in Emerging Markets”, with over 100 scholars and industry practitioners attended coming from worldwide.

Research papers presented include topics such as business model innovation, open innovation, role of venture capital in emerging markets, management of innovation,  managing global challenges, entrepreneurship and its ecosystem, new technology directions and challenges, discussed and moderated by scholars and experts in corresponding fields such as Wim Vanhaverbeke, Michael Condry, Jin Chen, Xiaohong Iris Quan, Xielin Liu,  Tariq Durrani, Sheila Forbes, Chunhsien Wang, Jizhen Li, Jiang Yu, etc.

As an IEEE TEMS signature event, Industry Forum was held on March 31st as part of the ISIE conference, featuring about twenty international experts, blending academic views with industry knowledge.  Three panels were held discussing topics including Reverse Innovation – Market- driven innovation and technology commercialization (moderated by Dr. Chun Xia, Tsinghua Silicon Valley Reverse Innovation), How to employer education with artificial intelligence (moderated by Dr. Carl Wang, TSVC Capital), and Management of emerging technologies in China (moderated by Dr. Xielin Liu). Separately, Xinmin Wan, Chief Engineer of Open Innovation at Haier, talked about innovation models in Haier, and Dave Fong, discussed innovation in the healthcare industry in the global context. Jihong Sanderson, visiting professor at Peking University and popular business author “AI Next Door”, gave a talk on the business practices of artificial intelligence in the new era.

The conference was successfully concluded by a field trip visit to BOE Technology Group Co., Ltd., an innovative IoT company providing display and sensor devices, smart systems and healthcare services.

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