Announcements Conferences Events News

Call for Papers: TEMSCON 2018

Call for Papers

        2018 International Conference of the IEEE Technology and Engineering Management Society

TEMSCON 2018

Orrington Hilton

Evanston, IL USA

2 blocks from Northwestern University campus

June 28-July 1, 2018

Engineering Management in an era of disruption

We invite contributions from researchers, educators, managers and students. Contributions may be conceptual, theoretical, or empirical. They should document research activities, case studies or best practices, shedding light on the theory or practice of engineering, technology, or innovation management, and addressing the strategic objectives of technological change.

There will be an opportunity to publish in IEEE Engineering Management Review as well as a Special Issue of our journal IEEE Transactions on Engineering Management for selected papers submitted to the conference.

Major topic areas include:

  • Entrepreneurship and its ecosystem
  • Management of innovation
  • Technology and engineering management
  • Strategy and global markets
  • New manufacturing and supply chain systems
  • Biotech and Healthcare Innovation,
  • Information Technology and the Internet
  • Social issues, sustainability, energy and infrastructure
  • Executive leadership, people and organizations
  • Special topic area: Impact of disruptive technologies on management

In addition to these core topics, we have special sessions on management during these challenging times as seen by IEEE societies. For topic details, see us at www.temscon.org.  We will also be hosting:

Education programs in Technology and Engineering Management

Speakers and panels on disruptive technologies and business and managerial practices

Tours of Chicago area technology and innovation centers

Editor’s Panel – publication outlets in Technology and Engineering Management

This event will include an Industry Forum on Technology Management Challenges in today’s world-June 29, 2018

Important Dates:       

  • Paper Submission Due: 1 December 2017
  • Early Bird Registration Begins  15 January 2018
  • Notification of Acceptance: 1 February 2018
  • Author Registration Due: 15 March 2018
  • Regular Registration: 15 March thru 20 June 2018
  • Hotel Block Deadline: 7 June 2018 

Organizing Committee:

General Co-Chairs: Mark Werwath, TEMS VP of Publications, Bakul Banerjee, Chair of TEMS Chicago Chapter

Program Co-Chairs: Peggy Matson, Northwestern University, Jason Hui, BAE Systems

For additional information, visit the conference webpage at www.temscon.org

About the author

Mark Werwath

Add Comment

Click here to post a comment

Leader PDF Version

We have launched an interactive document version of LEADER and its now available in two formats. You can either view online or download the PDF version of LEADER for your offline reading.

PDF Version:

High Resolution: Download(16 MB)

Medium Resolution: Download(6 MB)

Low Resolution: Download (3 MB)

View Online: Click Here

Join IEEE TEMS

Visit IEEE TEMS Website to get a glimpse of what we do and how you can contribute

Contribute to Leader

To contribute to TEMS Leader Magazine, Please click above image

Follow us on Twitter